The **ATS-04F-112-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.63°C/W (@ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Grease/Phase Change) | --- ## 2. Key Electronic Features ### A. pushPIN™ Mounting System This part uses a specialized push-pin mechanism. In electronics assembly, this is superior to simple adhesive because: * It provides **consistent pressure** across the component surface, improving thermal transfer. * It allows for **secure mechanical attachment** to the PCB (Printed Circuit Board) via pre-drilled holes. ### B. Thermal Performance (LFM) The efficiency of this heat sink is dependent on airflow (measured in Linear Feet per Minute). 1. **Low Airflow (100 LFM):** 2.63°C/W 2. **High Airflow (700 LFM):** 0.70°C/W *The lower the °C/W value, the better the heat sink is at removing heat.* ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 thermal interface material**. This fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance compared to dry contact. --- ## 3. Component Design Analysis * **Fin Design:** The "F" in the part number often denotes a specific fin density or pattern designed for optimal surface area within a 35x35mm footprint. * **Blue Anodized Coating:** Beyond aesthetics, the anodized layer provides a level of electrical insulation and increased corrosion resistance, which is vital for long-term reliability in electronic enclosures. * **Compatibility:** Designed primarily for square-packaged integrated circuits (ICs) that require active or passive cooling in telecommunications, computing, or industrial automation.