The **ATS-04F-115-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Fin Type** | XCUT (Straight Fin with cross-cut) | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.33°C/W (at 200 LFM) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Material:** Made of aluminum for optimal thermal conductivity-to-weight ratio. * **XCUT Fin Pattern:** The "XCUT" geometry allows for omnidirectional airflow. This means the cooling efficiency is maintained regardless of which direction the fan is blowing across the board. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat transfer. #### B. Attachment Mechanism (Push-Pin) * **Ease of Assembly:** It uses a tool-less push-pin system. The pins snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These provide a consistent "normal force" (downward pressure) to ensure the thermal interface material (TIM) is squeezed flat between the heat sink and the chip, maximizing heat transfer. #### C. Thermal Interface Material (TIM) * **Pre-Applied Phase Change Material:** Most units in this series come with **T766** or similar high-performance thermal pads pre-applied to the base. This eliminates the need for manual thermal paste application. --- ### 3. Electronic Application Use Cases This specific part is typically used in the following scenarios: 1. **Network Switches/Routers:** Cooling the main processing chips. 2. **Embedded Systems:** For industrial PCs where passive or forced-air cooling is required. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or voltage regulators. ---