The **ATS-04F-122-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as CPUs, GPUs, and high-density power modules. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance** | 5.87°C/W (at 1.0 m/s flow) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Pitch/Pattern** | 43.00mm | | **Flow Orientation** | Flat Fin (Straight) | --- ### 2. Key Design Components The "electronic" utility of this part is defined by its ability to manage thermal dissipation in restricted spaces. * **push-PIN™ Attachment:** This is a specialized mounting mechanism designed for quick and secure attachment to a Printed Circuit Board (PCB). It uses a flexible industry-standard hole pattern. * **Compression Springs:** The assembly includes a "pre-assembled" compression spring that ensures consistent pressure between the heat sink and the electronic component, optimizing thermal transfer. * **Thermal Interface Material (TIM):** The **R0** suffix typically indicates that the part comes with **T766** phase-change material or high-performance thermal tape pre-applied to the base. * **Flat Fin Profile:** The straight-fin design is optimized for environments where there is a consistent direction of airflow (forced convection), allowing heat to be carried away efficiently from the semiconductor junction. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific features: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **04** | Series or Product Line | | **F** | Fine Pitch (Fin density) | | **122** | Specific mechanical dimensions and thermal profile | | **C2** | Material/Finish Code (Blue Anodized Aluminum) | | **R0** | Packaging and Thermal Interface Material status | --- ### 4. Application Use Cases This heat sink is typically found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC motherboards. 3. **Power Supplies:** Cooling MOSFETs or IGBTs in power conversion circuits.