The **ATS-04F-127-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | Push-Pin (Straight Fins) | | **Thermal Resistance** | 3.84°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T766 (Pre-applied Thermal Interface Material) | --- ### 2. Key Electronic Features #### A. Thermal Efficiency The "C2" in the part number refers to the **Aluminum Blue Anodized** finish. This finish is not just aesthetic; it improves surface emissivity and provides a layer of protection against environmental corrosion, ensuring long-term thermal reliability. #### B. Push-Pin Attachment Mechanism This part utilizes a **Push-Pin** mounting system with a compression spring. * **Uniform Pressure:** Ensures consistent contact between the heat sink base and the electronic component (IC). * **Vibration Resistance:** The spring-loaded mechanism prevents the heat sink from shifting or losing contact during mechanical shock or vibration. #### C. Pre-Applied Thermal Interface Material (TIM) The unit comes with **T766 phase-change material** pre-applied. This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a high-quality thermal bridge between the chip and the aluminum fins. --- ### 3. Thermal Performance Profile Thermal performance is highly dependent on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.84 | | **300 (1.5 m/s)** | 2.58 | | **500 (2.5 m/s)** | 1.81 | | **700 (3.5 m/s)** | 1.48 | --- ### 4. Typical Applications * **BGA Cooling:** Ideal for Ball Grid Array processors. * **Telecommunications:** Cooling for high-speed networking switches. * **Industrial PC:** Thermal management in embedded systems where space is limited but power density is high.