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  • ATS-04F-133-C2-R0

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    The **ATS-04F-133-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance (Flow)** | 7.42°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Resistance (Static)** | 1.83°C/W @ 400 LFM | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Straight Fin (cross-cut for omnidirectional airflow) | --- ### 2. Design Features * **Miniature Form Factor:** With a base size of 30mm x 30mm, it is ideal for small PCBs (Printed Circuit Boards) and tight electronic enclosures. * **push-pin Attachment:** This part utilizes a standardized push-pin mechanism. This provides high-reliability attachment and consistent pressure on the component, improving thermal transfer. * **Blue Anodized Coating:** The surface treatment is not just aesthetic; it provides corrosion resistance and increases surface emissivity for better radiant heat dissipation. * **Omnidirectional Airflow:** The fin pattern is designed to work efficiently regardless of the direction of the airflow provided by the system fan. --- ### 3. Thermal Interface Material (TIM) The **C2** suffix in the part number indicates that this unit typically comes with a specific thermal interface: * **Type:** T766 (High Performance) * **Function:** It fills the microscopic air gaps between the component surface and the heat sink base to maximize heat conduction. --- ### 4. Part Number Breakdown The naming convention follows the ATS "push-pin" series logic: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04** | Series Identifier (Plastic Push-Pin) | | **F** | Pitch/Fin Density indicator | | **133** | Unique identifier for specific dimensions | | **C2** | Thermal Interface Material (T766) | | **R0** | Revision/Standard RoHS compliant version |
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink based on my chip's TDP?
    • ⤷ What is the specific hole diameter required on the PCB for the push-pin mounting?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?