ATS-04F-133-C2-R0
AI

The **ATS-04F-133-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as CPUs, GPUs, and power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance (Flow)** | 7.42°C/W @ 100 LFM (Linear Feet per Minute) |
| **Thermal Resistance (Static)** | 1.83°C/W @ 400 LFM |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm |
| **Fin Style** | Straight Fin (cross-cut for omnidirectional airflow) |
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### 2. Design Features
* **Miniature Form Factor:** With a base size of 30mm x 30mm, it is ideal for small PCBs (Printed Circuit Boards) and tight electronic enclosures.
* **push-pin Attachment:** This part utilizes a standardized push-pin mechanism. This provides high-reliability attachment and consistent pressure on the component, improving thermal transfer.
* **Blue Anodized Coating:** The surface treatment is not just aesthetic; it provides corrosion resistance and increases surface emissivity for better radiant heat dissipation.
* **Omnidirectional Airflow:** The fin pattern is designed to work efficiently regardless of the direction of the airflow provided by the system fan.
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### 3. Thermal Interface Material (TIM)
The **C2** suffix in the part number indicates that this unit typically comes with a specific thermal interface:
* **Type:** T766 (High Performance)
* **Function:** It fills the microscopic air gaps between the component surface and the heat sink base to maximize heat conduction.
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### 4. Part Number Breakdown
The naming convention follows the ATS "push-pin" series logic:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **04** | Series Identifier (Plastic Push-Pin) |
| **F** | Pitch/Fin Density indicator |
| **133** | Unique identifier for specific dimensions |
| **C2** | Thermal Interface Material (T766) |
| **R0** | Revision/Standard RoHS compliant version |
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How do I calculate the required airflow (LFM) for this heat sink based on my chip's TDP?
- ⤷ What is the specific hole diameter required on the PCB for the push-pin mounting?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?