The **ATS-04F-156-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight (optimized for airflow) | | **Attachment Method** | Push-Pin (with 27mm pitch) | | **Thermal Resistance** | 4.14 °C/W (@ 1.0 m/s airflow) | | **Thermal Interface Material** | T766 (pre-applied thermal pad) | --- ### 2. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic system is critical for stability and longevity: * **Thermal Dissipation:** It increases the surface area of the integrated circuit (IC), allowing heat to transfer more efficiently to the surrounding air via convection. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes with **T766** thermal grease/pad. This fills microscopic air gaps between the chip and the heat sink, reducing thermal impedance. * **Component Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents thermal throttling and permanent silicon damage. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific features: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **04** | Attachment style (Push-Pin) | | **F** | Fin height/Style category | | **156** | Specific footprint/geometry code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Installation & Compatibility This heat sink is designed for **PCB-level mounting**. It uses a spring-loaded push-pin mechanism which provides: 1. **Consistent Pressure:** Ensures the thermal pad is compressed correctly against the chip. 2. **Ease of Assembly:** Can be installed manually or with automated equipment without specialized tools. 3. **Vibration Resistance:** The spring tension keeps the heat sink secure even in mobile or high-vibration environments.