The **ATS-04F-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Style** | Fine-Pitch | | **Fin Pattern** | XCUT | | **Thermal Resistance (Unducted)** | 3.62 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.99 °C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ### 2. Key Components & Design Features #### A. XCUT Fin Geometry The "XCUT" design features a cross-cut fin pattern. Unlike straight fins, this pattern allows for airflow from multiple directions, making it highly effective in systems where the direction of airflow might be inconsistent or obstructed. #### B. PushPIN™ Attachment System This heat sink utilizes a specialized mounting mechanism rather than adhesive: - **Spring-loaded Pins:** Provides precise and consistent pressure across the interface to optimize thermal transfer. - **Hardware:** Usually paired with brass or plastic pins and high-tension springs. - **Ease of Assembly:** Designed for quick installation on pre-drilled PCBs. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of Thermal Interface Material pre-applied to the base. - **T766:** This specific model typically comes with **ATS-T766** phase-change material or high-performance thermal grease to ensure there are no air gaps between the component and the heat sink. #### D. Material and Coating - **Aluminum (AL6063):** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves emissivity. --- ### 3. Application Use Cases This part is commonly found in: * **Networking Gear:** Switches and routers where airflow is forced. * **Embedded Systems:** Industrial PCs requiring rugged mounting. * **Power Electronics:** Cooling MOSFETs or power regulators. ---