The **ATS-04F-175-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing Air)** | 13.52°C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 2.50°C/W (at high velocity) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimension (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Design Characteristics This component is engineered with specific electronic cooling principles in mind: * **XCUT Fin Geometry:** The fins are not continuous strips; they are cross-cut into smaller pins. This increases surface area and creates more turbulence in the airflow, which helps break up the boundary layer and improves heat dissipation. * **Push-Pin Attachment:** It uses a plastic push-pin with a stainless steel spring. This provides a precise "clamping force" (pressure) on the electronic chip, ensuring optimal contact between the chip surface and the heat sink base. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "phase-change" material that melts slightly at operating temperatures to fill microscopic air gaps between the heat sink and the electronic part. --- ### 3. Applications The ATS-04F-175-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** For cooling signal processors in base stations. 2. **Embedded Systems:** For industrial PCs where vertical space (10mm height) is limited. 3. **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data *Note: Performance varies based on air velocity (Linear Feet per Minute - LFM).* | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | 600 | 700 | | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 13.52 | 7.53 | 5.48 | 4.44 | 3.82 | 3.39 | 3.08 | ---