The **ATS-04F-180-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications This heat sink belongs to the **push-pin** attachment family, known for providing secure mounting and consistent pressure on the component. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 35mm | | **Fin Style** | Straight Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Core Components & Electronic Function ### A. The Heat Sink Body Constructed from high-grade aluminum, the body uses vertical fins to increase the total surface area. In electronics, the goal is to transfer heat from the junction of a semiconductor to the surrounding air. The 35mm height provides a significant volume for heat dissipation in systems with vertical space. ### B. Attachment Mechanism (Push-Pins) The "04F" and "R0" designations often refer to the specific mounting hardware: * **Push-Pins:** These provide a defined amount of force (compression) to ensure the heat sink makes perfect contact with the electronic chip. * **Springs:** The pins are usually equipped with springs to maintain constant pressure regardless of thermal expansion or vibrations. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a "Phase Change Material" or thermal grease that fills microscopic air gaps between the component and the metal heat sink, drastically lowering thermal resistance. --- ## 3. Thermal Performance Analysis The efficiency of this part is measured by its thermal resistance ($^\circ C/W$). Lower values indicate better cooling. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **200 LFM (Linear Feet per Minute)** | 3.32 °C/W | | **400 LFM** | 1.61 °C/W | | **600 LFM** | 1.23 °C/W | --- ## 4. Typical Applications This specific model is frequently found in: * **Networking Equipment:** Routers and switches where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs where reliability is critical. * **Power Supplies:** Cooling voltage regulators or MOSFETs.