ATS-04F-185-C2-R0
AI

The **ATS-04F-185-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs.
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## 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 30mm |
| **Thermal Resistance** | 3.35°C/W (at 100 LFM) |
| **Fin Pattern** | Cross-cut (to optimize airflow) |
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## 2. Key Features and Components
### A. Fin Design
* **Structure:** The "04F" series features a cross-cut fin design. This improves the turbulence of the air passing through the fins, allowing for better heat dissipation compared to straight-line fins.
* **Surface Area:** The 30mm height provides a significant surface area for heat transfer to the ambient air.
### B. The pushPIN™ Attachment System
This heat sink uses a proprietary push-pin system rather than adhesive or standard screws:
* **Compression Spring:** Ensures consistent pressure (force) on the component to maximize thermal interface material (TIM) performance.
* **Pins:** Usually made of brass or plastic, these snap into pre-drilled holes in the PCB.
### C. Thermal Interface Material (TIM)
* The part number usually indicates it comes with **T766** pre-applied thermal phase-change material or grease. This ensures no air gaps exist between the chip and the heat sink base.
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## 3. Performance Analysis
Thermal resistance is the measure of how well the heat sink resists the flow of heat. A lower value is better.
| Airflow (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 3.35 | 1.98 | 1.62 | 1.44 | 1.31 |
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## 4. Part Number Breakdown
The nomenclature follows a specific logic:
* **ATS:** Advanced Thermal Solutions
* **04:** Heat Sink Series
* **F:** Fin configuration (Cross-cut)
* **185:** Specific size/footprint code
* **C2:** Material/Thermal performance grade
* **R0:** ROHS compliant / Revision code
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- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ Can this heat sink be used with a 12V DC cooling fan?
- ⤷ How does 'Blue Anodized' finish affect thermal performance?