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  • ATS-04F-198-C2-R0

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    The **ATS-04F-198-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, ASICs, and GPUs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04F-198-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design The unit features a **straight-fin** or **cross-cut** design (depending on the specific revision within the 198 series), optimized for longitudinal airflow. The aluminum construction ensures rapid heat dissipation from the component surface to the surrounding air. #### B. Mechanical Attachment * **Push-Pins:** It utilizes two brass push-pins. This allows for a secure, vibration-resistant mount to the PCB. * **Compression Springs:** These provide consistent downward pressure on the electronic chip, ensuring the thermal interface material fills all microscopic gaps for maximum heat transfer. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766** thermal grease. This is pre-applied at the factory to simplify the assembly process and ensure uniform coverage across the contact surface. --- ### 3. Thermal Performance Indicators The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (200 LFM)** | ~9.06 | | **Unducted (400 LFM)** | ~4.66 | | **Unducted (600 LFM)** | ~3.56 | --- ### 4. Common Applications * **Networking Equipment:** Switches, routers, and high-speed modems. * **Computing:** Secondary processors or high-heat chipsets on motherboards. * **Industrial Power Supplies:** Cooling power-regulating ICs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting on this model?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance versus bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?