ATS-04F-198-C2-R0
AI

The **ATS-04F-198-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, ASICs, and GPUs.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-04F-198-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Component Features
#### A. Fin Design
The unit features a **straight-fin** or **cross-cut** design (depending on the specific revision within the 198 series), optimized for longitudinal airflow. The aluminum construction ensures rapid heat dissipation from the component surface to the surrounding air.
#### B. Mechanical Attachment
* **Push-Pins:** It utilizes two brass push-pins. This allows for a secure, vibration-resistant mount to the PCB.
* **Compression Springs:** These provide consistent downward pressure on the electronic chip, ensuring the thermal interface material fills all microscopic gaps for maximum heat transfer.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766** thermal grease. This is pre-applied at the factory to simplify the assembly process and ensure uniform coverage across the contact surface.
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### 3. Thermal Performance Indicators
The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Rate (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **Unducted (200 LFM)** | ~9.06 |
| **Unducted (400 LFM)** | ~4.66 |
| **Unducted (600 LFM)** | ~3.56 |
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### 4. Common Applications
* **Networking Equipment:** Switches, routers, and high-speed modems.
* **Computing:** Secondary processors or high-heat chipsets on motherboards.
* **Industrial Power Supplies:** Cooling power-regulating ICs.
- ⤷
What are the PCB hole requirements for the push-pin mounting on this model?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance versus bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?