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  • ATS-04F-203-C2-R0

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    The **ATS-04F-203-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass, Plastic) | | **Heat Sink Type** | XCUT (Cross-Cut) | | **Thermal Resistance** | 8.93°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | --- ### 2. Design and Composition #### A. Fin Pattern: XCUT (Cross-Cut) The "XCUT" design allows for multi-directional airflow. Unlike straight-fin heat sinks that require air to flow along a single axis, cross-cut fins capture air from various angles, making it highly efficient for systems with unpredictable or turbulent airflow. #### B. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. #### C. Attachment Mechanism: Push-Pin The model uses a **spring-loaded push-pin** mechanism. * **Ease of Install:** Requires pre-drilled holes in the PCB. * **Reliability:** The spring provides consistent pressure (interface pressure) between the heat sink and the component, ensuring maximum thermal contact. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the chip. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 8.93 | | 400 | 2.0 | 4.33 | | 600 | 3.0 | 3.11 | --- ### 4. Part Number Breakdown (Example Logic) * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series or size category. * **F:** Fin pitch/density indicator. * **203:** Specific dimensional code (54x54x10mm). * **C2:** Thermal Interface Material (TIM) type (usually T766 or similar). * **R0:** Revision/RoHS compliance status. --- ### 5. Application Usage This part is typically used for: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators.
    ✨ Follow-up Questions
    • ⤷ What are the specific hole pattern dimensions required for the push-pin installation?
    • ⤷ How does the 'C2' thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink with a higher profile for better passive cooling?