ATS-04F-203-C2-R0
AI

The **ATS-04F-203-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits.
---
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Brass, Plastic) |
| **Heat Sink Type** | XCUT (Cross-Cut) |
| **Thermal Resistance** | 8.93°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm |
---
### 2. Design and Composition
#### A. Fin Pattern: XCUT (Cross-Cut)
The "XCUT" design allows for multi-directional airflow. Unlike straight-fin heat sinks that require air to flow along a single axis, cross-cut fins capture air from various angles, making it highly efficient for systems with unpredictable or turbulent airflow.
#### B. Material and Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer.
#### C. Attachment Mechanism: Push-Pin
The model uses a **spring-loaded push-pin** mechanism.
* **Ease of Install:** Requires pre-drilled holes in the PCB.
* **Reliability:** The spring provides consistent pressure (interface pressure) between the heat sink and the component, ensuring maximum thermal contact.
---
### 3. Thermal Performance Metrics
Thermal resistance indicates how effectively the part moves heat away from the chip.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 8.93 |
| 400 | 2.0 | 4.33 |
| 600 | 3.0 | 3.11 |
---
### 4. Part Number Breakdown (Example Logic)
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04:** Series or size category.
* **F:** Fin pitch/density indicator.
* **203:** Specific dimensional code (54x54x10mm).
* **C2:** Thermal Interface Material (TIM) type (usually T766 or similar).
* **R0:** Revision/RoHS compliance status.
---
### 5. Application Usage
This part is typically used for:
* **Networking Equipment:** Routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or power regulators.
- ⤷
What are the specific hole pattern dimensions required for the push-pin installation?
- ⤷ How does the 'C2' thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a higher profile for better passive cooling?