The **ATS-04F-204-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is designed for cooling electronic components, specifically integrated circuits (ICs) like CPUs, GPUs, or FPGAs. Below is a detailed breakdown of its specifications and electronic application. ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04F-204-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.43°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | XC-Cut (Cross-cut / Pin Fin) | --- ### 2. Design and Thermal Management The part is engineered to maximize surface area and airflow efficiency in tight electronic enclosures. * **XC-Cut Fin Design:** Unlike straight-fin heat sinks, the "cross-cut" or pin-fin design allows for omnidirectional airflow. This is critical in electronics where air might enter from different angles depending on the system fans. * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. * **Low Profile:** Standing at only 12.70mm, it is ideal for low-profile server blades or compact consumer electronics. --- ### 3. Attachment Mechanism One of the defining "electronic parts" of this assembly is the mounting hardware: * **Push-Pins:** It uses plastic push-pins with a brass spring. * **Compression Spring:** The spring ensures constant pressure between the heat sink and the electronic component, which is vital for maintaining a consistent thermal interface. * **TIM (Thermal Interface Material):** These units typically come with a pre-applied **Chomerics T766** thermal pad or similar, which fills microscopic air gaps between the chip and the heat sink. ### 4. Integration Example To integrate this into a PCB design, the following considerations are required: ```markdown 1. Hole Pattern: Requires two 3.0mm diameter holes on the PCB. 2. Component Clearance: Ensure no tall capacitors are within the 54x54mm footprint. 3. Airflow Direction: Optimized for forced convection (fans). ``` ---