The **ATS-04F-207-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 100mm x 100mm x 25mm | | **Fin Style** | XCUT (Cross-Cut) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.39°C/W (at 200 LFM) | --- ### 2. Physical Design and Construction * **XCUT Fin Pattern:** The "XCUT" geometry features vertical and horizontal gaps between the fins. This design is highly effective in environments where airflow direction might vary or where "omni-directional" cooling is required. * **Aluminum Body:** Chosen for its excellent thermal conductivity-to-weight ratio, ensuring heat is moved away from the semiconductor junction quickly. * **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the heat sink, slightly improving radiant heat transfer. --- ### 3. Mounting and Thermal Interface * **Push-Pin Attachment:** The device uses a brass push-pin mechanism with a compressed spring. This ensures a consistent and reliable downward pressure (clamping force) on the electronic component, which is critical for thermal efficiency. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the heat sink. --- ### 4. Thermal Performance Curves The effectiveness of this part depends heavily on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.39 | | 400 | 2.13 | | 600 | 1.34 | *Higher LFM results in significantly lower thermal resistance, meaning the part becomes much more efficient as fan speed increases.* ---