The **ATS-04F-208-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.50°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 6.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Low Profile Geometry With a height of only **6.00mm**, this heat sink is designed for high-density electronic assemblies where vertical space is limited (e.g., 1U servers or thin embedded systems). #### B. The pushPIN™ Attachment System The "04F" and "R0" designations refer to the specific mounting hardware: * **Push-Pins:** This model uses brass pins with integrated springs. * **Engagement:** The springs provide a precise, consistent pressure (preload) against the component, ensuring maximum heat transfer without damaging the chip. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing contact resistance. --- ### 3. Part Number Breakdown The nomenclature for this series follows a specific logic: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04** | Series Number | | **F** | Fine pitch (Fin density) | | **208** | Specific kit/dimension code | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision/Packaging code | --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking processors. * **Computing:** Low-profile VRM or chipset cooling. * **Industrial:** Power supply components and high-speed motor controllers.