The **ATS-04F-21-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **blueICE™** series and is designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 60mm x 60mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 16.28°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics The ATS-04F-21-C2-R0 features specific design choices tailored for modern PCB environments: * **Low Profile:** With a height of only 10mm, it is ideal for 1U server racks, blade servers, and compact electronic enclosures where vertical space is limited. * **pushPIN™ Attachment:** Instead of messy adhesives or clips, it uses a push-pin mechanism with a specific spring rate. This ensures constant, uniform pressure across the component surface for optimal heat transfer. * **Straight Fin Pattern:** This design is optimized for **forced convection** (airflow directed by fans). The straight fins provide low resistance to airflow while maximizing surface area. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a high-conductivity material that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** For industrial PCs where reliability and vibration resistance (provided by the push-pins) are required. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). ---