The **ATS-04F-26-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 14.20 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### Key Electronic Components & Features #### 1. Heat Dissipation Mechanism The ATS-04F-26-C2-R0 uses a **straight-fin** design. In electronics, this allows for maximum airflow through the fins, which is essential for forced convection cooling (using a fan). The low profile (10mm height) makes it ideal for dense PCB layouts where vertical space is limited. #### 2. Attachment System (Push Pins) Instead of adhesive tapes, this part uses a **spring-loaded push-pin** mechanism. - **Benefits:** Provides consistent pressure on the electronic component, ensuring better thermal contact and long-term reliability against vibrations. - **Hole Pattern:** Requires pre-drilled holes in the PCB. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - **Function:** This is a phase-change material that fills the microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface emissivity, which slightly improves heat dissipation through radiation and protects the aluminum from corrosion and electrical conductivity on the surface. --- ### Comparison: Airflow vs. Thermal Resistance The efficiency of this part is highly dependent on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Low) | 14.20 | | 400 (Med) | 5.30 | | 600 (High) | 3.20 | --- ### Typical Applications * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators.