ATS-04F-30-C3-R0
AI

The **ATS-04F-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35mm x 35mm x 25mm |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 5.35°C/W (Unducted Flow @ 100 LFM) |
| **Fin Pattern** | Fine Pitch (Straight Fin) |
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### 2. Key Design Elements
#### A. pushPIN™ Attachment System
Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** mechanism. This ensures:
* **Constant Pressure:** Maintains uniform contact between the heat sink and the component for optimal heat transfer.
* **Ease of Assembly:** Can be installed quickly on a PCB with pre-drilled holes.
#### B. Material and Finish
* **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates that the unit comes with a **Pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a clean and consistent thermal bond.
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### 3. Application Use Cases
This specific heat sink is categorized as a "Medium Profile" cooler, making it suitable for:
* **Telecommunications:** Cooling networking chips in routers and switches.
* **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical.
* **Power Supplies:** Managing heat in DC-DC converters or voltage regulators.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Brand)
* **04:** Series/Family
* **F:** Fin pitch/style
* **30:** Package size/Dimensions
* **C3:** Material/Color code (Aluminum, Blue Anodized)
* **R0:** Revision or Thermal Interface specific code
- ⤷
What are the specific PCB hole diameters required for the push-pin mounting?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 400 LFM)?
- ⤷ Is this heat sink compatible with standard 35x35mm BGA components?