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  • ATS-04F-30-C3-R0

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    The **ATS-04F-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 5.35°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Key Design Elements #### A. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** mechanism. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the component for optimal heat transfer. * **Ease of Assembly:** Can be installed quickly on a PCB with pre-drilled holes. #### B. Material and Finish * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes with a **Pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a clean and consistent thermal bond. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Medium Profile" cooler, making it suitable for: * **Telecommunications:** Cooling networking chips in routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. * **Power Supplies:** Managing heat in DC-DC converters or voltage regulators. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Brand) * **04:** Series/Family * **F:** Fin pitch/style * **30:** Package size/Dimensions * **C3:** Material/Color code (Aluminum, Blue Anodized) * **R0:** Revision or Thermal Interface specific code
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameters required for the push-pin mounting?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Is this heat sink compatible with standard 35x35mm BGA components?