The **ATS-04F-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family designed for cooling Integrated Circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-04F-36-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height (Fin Height)** | 12.70 mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Double-sided thermal tape) | --- ### 2. Design and Component Breakdown #### A. The Fin Design (High Performance) The "F" in the part number often refers to the **Fine Pitch** or a specific fin geometry. These heatsinks typically use a cross-cut or straight-fin design to maximize surface area for heat dissipation. * **Purpose:** To transfer heat from the semiconductor die into the surrounding air via convection. #### B. The Push-Pin Attachment Mechanism Unlike adhesive-only heatsinks, the ATS-04F-36-C3-R0 uses a mechanical **Push-Pin** system. * **Spring-Loaded:** The brass push-pins use a compression spring to apply consistent, even downward pressure on the component. * **Reliability:** This prevents the heatsink from shifting during high-vibration environments or thermal expansion cycles. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412 thermal tape**. * **Function:** It fills microscopic air gaps between the CPU/GPU surface and the aluminum base. * **Performance:** T412 is known for high thermal conductivity and strong adhesion, providing a secondary layer of security alongside the pins. --- ### 3. Application Use Cases * **BGA Cooling:** Primarily used for Ball Grid Array (BGA) components like Chipsets, FPGAs, and Processors. * **Telecommunications:** Used in routers and switches where airflow is consistent but heat density is high. * **Industrial PC:** Suitable for embedded systems requiring long-term mechanical stability. --- ### 4. Thermal Performance Profile The effectiveness of this part depends heavily on the **Airflow (LFM - Linear Feet per Minute)**: * **Low Airflow:** Higher thermal resistance (the heatsink is less effective). * **High Airflow:** Lower thermal resistance (the heatsink rapidly dissipates heat).