The **ATS-04F-47-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.03 °C/W (at 100 LFM) | | **Length x Width** | 30.00 mm x 30.00 mm | | **Height** | 10.00 mm | | **Fin Style** | Straight | | **Fin Pattern** | XCUT | --- ### 2. Key Features & Components #### A. pushPIN™ Attachment System This heat sink utilizes a **pushPIN™** mechanism, which consists of a brass or plastic pin and a high-compression spring. * **Benefit:** Provides consistent pressure on the heat source, ensuring optimal thermal interface material (TIM) performance. * **Installation:** It requires pre-drilled holes in the Printed Circuit Board (PCB). #### B. XCUT Fin Design The "XCUT" geometry refers to the way the aluminum fins are machined. * **Airflow:** It is designed for multi-directional airflow, making it effective in systems where air direction might change or is turbulent. * **Surface Area:** Increases the total surface area for heat exchange without significantly increasing the footprint. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a specific thermal pad or grease (typically **T766**), which is pre-applied to the base of the heat sink to bridge the microscopic air gaps between the component and the metal. --- ### 3. Application Use Cases This specific heat sink is categorized as a low-profile solution (10mm height), making it ideal for: 1. **Network Switches & Routers:** Components where vertical space is limited. 2. **Embedded Systems:** Industrial PCs or IoT gateways. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators. ---