ATS-04F-52-C3-R0
AI

The **ATS-04F-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
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### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-04F-52-C3-R0 |
| **Material** | Aluminum |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 10.80°C/W (at 100 LFM) to 1.30°C/W (at 700 LFM) |
| **Dimensions** | 35mm x 35mm x 25mm |
| **Fin Type** | Fine-Pitch (Straight Fin) |
| **Finish** | Blue Anodized |
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### 2. Physical Design and Construction
The "electronic parts" of this assembly are purely mechanical and thermal in nature. They do not contain circuitry but are critical for the reliability of the circuits they protect.
* **Heatsink Body:** Made from high-grade aluminum for excellent thermal conductivity. The fins are arranged in a "Fine-Pitch" pattern to maximize surface area for air interaction.
* **pushPIN™ Mounting:** This model uses a tool-free mounting system. It consists of a plastic or metal pin and a spring.
* **Spring:** Provides precise, uniform pressure (load) on the component (IC) to ensure optimal contact with the Thermal Interface Material (TIM).
* **Blue Anodized Finish:** Not only provides a professional look but also increases the surface emissivity, slightly improving radiation heat transfer and providing corrosion resistance.
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### 3. Usage Context
This part is typically used on **Printed Circuit Boards (PCBs)** where a specific high-heat component needs cooling via forced convection (airflow).
#### Installation Overview:
1. **Preparation:** A Thermal Interface Material (like thermal grease or a pad) is applied to the chip.
2. **Alignment:** The heatsink is placed over the component, aligning the pushPINs with pre-drilled holes in the PCB.
3. **Engagement:** The pins are pushed through until they "click," locking the heatsink in place with constant spring pressure.
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### 4. Part Number Breakdown (Example)
* **ATS:** Advanced Thermal Solutions (Brand)
* **04:** Series/Family
* **F:** Fine-Pitch fin configuration
* **52:** Specific dimensions/height profile
* **C3:** Material/Thermal performance grade
* **R0:** Revision or specific packaging code
- ⤷
What is the significance of the 'Fine-Pitch' fin design for airflow?
- ⤷ How does the pushPIN mounting system compare to adhesive thermal tapes?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for this heatsink?