The **ATS-04F-55-C3-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** heat sink series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance (Unducted)** | 24.11 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T412 (High performance) | | **Thermal Resistance (Ducted)** | 4.53 °C/W | --- ### 2. Key Electronic Components & Design The "Electronic" functionality of this part is passive, focused on heat dissipation to prevent thermal throttling or component failure. #### A. Fin Profile (Straight Fin) The **C3** designation indicates a specific fin pattern. Straight fins provide low pressure drop and are ideal for environments where airflows are predictable. The 10mm height makes it suitable for low-profile electronic enclosures (1U servers or slim networking gear). #### B. PushPIN™ Attachment Mechanism Unlike adhesive tapes that can fail over time due to heat, this part uses a mechanical pushPIN™ system: * **Compression Springs:** Ensure even pressure across the electronic chip (CPU/GPU/FPGA), maximizing heat transfer. * **Plastic/Brass Pins:** Secure the sink through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (T412) The "R0" suffix often refers to the specific revision and the pre-applied **T412 Thermal Interface Material**. This is a phase-change or high-conductivity pad that fills microscopic air gaps between the component surface and the heat sink base. --- ### 3. Applications in Electronics This heat sink is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed signal processors. 2. **Networking:** Switches and routers where space is limited. 3. **Industrial PCs:** Ensuring stability in high-ambient temperature environments. 4. **Embedded Systems:** Protecting SoCs (System on Chips) from overheating. ---