The **ATS-04F-56-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | XCUT (Cross-cut) | | **Thermal Resistance (Flowing)** | 6.66 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.36 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Pitch** | 1.27mm (approximate fin spacing) | | **TIM (Thermal Interface Material)** | T412 (High performance) | --- ### Key Electronic Components & Features #### 1. The Fin Design (XCUT) The "XCUT" geometry refers to a cross-cut pattern. In electronic cooling, this design allows for multi-directional airflow. Unlike straight-fin heat sinks, XCUT designs are ideal for PCBs where the direction of the airflow from fans might be unpredictable or obstructed. #### 2. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism: * **Compression Springs:** Provides precise pressure to ensure maximum contact between the heat sink and the chip. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. #### 3. Thermal Interface Material (T412) The "C3" in the part number indicates the specific thermal interface material (TIM) pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink base and the electronic component (CPU, FPGA, or GPU). * **Type:** T412 is a high-efficiency thermal tape/grease that improves heat transfer significantly compared to dry mounting. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics. Anodization increases: * **Emissivity:** Improving heat radiation to the surrounding environment. * **Corrosion Resistance:** Protecting the aluminum from oxidation in humid industrial environments. * **Electrical Insulation:** Providing a non-conductive surface to prevent short circuits if the heat sink accidentally touches a live component. --- ### Typical Applications * **Processing Units:** Cooling FPGAs, ASICs, and microprocessors. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Heat dissipation for high-output power transistors.