The **ATS-04F-73-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 14.80°C/W (Unducted) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Components & Design The "electronic" functionality of this part is mechanical in nature, aimed at protecting electronic circuits from thermal runaway. #### A. The pushPIN™ Attachment System This part features a specialized mounting system designed for PCBs (Printed Circuit Boards). - **The Mechanism:** It uses a brass or plastic pin with a compressed spring. - **Benefit:** Ensures constant, uniform pressure against the electronic component, which optimizes thermal interface material (TIM) performance. #### B. Material and Finish - **Aluminum (6063):** Chosen for its high thermal conductivity and lightweight properties. - **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases surface emissivity and provides corrosion resistance, which is critical for long-term reliability in electronic enclosures. #### C. Thermal Performance (Deg C/W) This part is engineered for specific airflow conditions. The efficiency changes based on the air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 200 | 300 | 400 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.80 | 5.60 | 3.10 | 2.20 | --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC (IPC):** Embedded systems requiring passive or active cooling. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown The part number follows the ATS naming convention: - **ATS:** Manufacturer (Advanced Thermal Solutions). - **04:** Series/Attachment type. - **F:** Fine Pitch (Fin density). - **73:** Height/Specific geometry code. - **C3:** Thermal Interface Material (TIM) type (typically pre-applied phase-change material or thermal tape). - **R0:** Revision/Packaging code.