The **ATS-04F-74-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs). ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 8.90°C/W (at 100 LFM) | | **Flow Direction** | Vertical-cut (Cross-cut) | --- ### 2. Key Component Features #### A. Thermal Performance The "C3" in the part number indicates a specific thermal profile. The heat sink uses a **cross-cut fin pattern**, which allows for airflow from multiple directions, making it ideal for systems where air currents might be unpredictable or multidirectional. #### B. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this model uses a mechanical attachment system: * **Compression Springs:** Provide precise pressure to the processor or component for maximum thermal transfer. * **Brass Bolts/Plastic Pins:** Ensure the heat sink remains securely fastened even during high-vibration scenarios (standard in industrial or aerospace applications). #### C. Material and Finish The aluminum construction provides a balance between lightweight design and high thermal conductivity. The **Blue Anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiative cooling. --- ### 3. Typical Applications This specific size and thermal rating are commonly used for: 1. **High-speed Processors:** Small form factor CPUs or high-end MCUs. 2. **FPGAs & ASICs:** Used in telecommunications and data centers. 3. **Power Electronics:** Cooling MOSFETs or power regulators in high-density power supplies. ---