The **ATS-04F-77-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), specifically BGA (Ball Grid Array) components. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04F-77-C3-R0 | | **Heatsink Type** | pushPIN™ Standard | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 9.58°C/W (@ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Core Design Components The "pushPIN™" system used in this part consists of three main electronic/mechanical elements: * **Heat Sink Body:** The 25x25mm aluminum block features vertical fins that increase surface area, allowing heat to transfer from the component to the surrounding air. * **Push-Pins:** These are precision-molded nylon or brass pins that pass through pre-drilled holes in the Printed Circuit Board (PCB). They provide the necessary downward force to ensure high thermal contact. * **Compression Springs:** These sit on the push-pins to provide a specific, consistent pressure (preload) between the heat sink and the electronic chip, preventing gaps that cause overheating. --- ### 3. Application and Performance The **ATS-04F-77-C3-R0** is used primarily in compact electronic environments where airflow is present but space is limited. #### Thermal Performance Table (Airflow vs. Resistance) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.58 | | 300 (1.5 m/s) | 3.87 | | 500 (2.5 m/s) | 2.67 | | 700 (3.5 m/s) | 2.15 | --- ### 4. Thermal Interface Material (TIM) The part suffix "**C3**" indicates that it typically comes with a pre-applied high-performance **Thermal Interface Material**. This is a conductive pad or grease located on the base of the heat sink that fills microscopic air gaps between the heat sink and the CPU/GPU, significantly improving heat transfer efficiency.