The **ATS-04F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "push pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 2.63° C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Component Design Breakdown #### A. Fin Profile (Straight Fin) The "79" in the series typically refers to the **Straight Fin** geometry. Straight fins are optimized for unidirectional airflow. This design allows for a lower pressure drop and efficient heat dissipation when used with a dedicated cooling fan. #### B. Push-Pin Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin** system: * **Precision:** Ensures consistent pressure across the component (CPU/GPU/ASIC). * **Reliability:** Resistant to shock and vibration compared to "peel-and-stick" tapes. * **Hole Pattern:** Requires pre-drilled holes in the PCB for the 4.7mm (standard) push pins. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic; the anodized layer increases the surface emissivity, slightly improving radiative cooling, and provides corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) indicates how much the temperature rises per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.63 | | 200 (1.0 m/s) | 1.99 | | 400 (2.0 m/s) | 1.60 | | 600 (3.0 m/s) | 1.42 | --- ### 4. Applications This specific size (25mm x 25mm) is commonly used for: * **Northbridge/Southbridge** chips on motherboards. * **FPGA and ASIC** cooling in industrial networking equipment. * **High-power LED** thermal management. * **Motor Drivers** in robotics.