ATS-04F-82-C3-R0
AI

The **ATS-04F-82-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets.
---
## 1. Technical Specifications
The following table highlights the key physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 10.97°C/W (at 200 LFM) |
| **Attachment Method** | Push Pin (Brass) with Compression Spring |
| **Dimension (L x W)** | 30mm x 30mm |
| **Height** | 15mm |
| **Fin Pattern** | Square Pin Fin (Omni-directional) |
---
## 2. Key Design Features
### Thermal Interface Material (TIM)
The part comes pre-applied with **T412**, a high-performance Phase Change Material (PCM). This ensures maximum heat transfer between the electronic component and the heat sink base without requiring manual paste application.
### Push Pin Mounting
Unlike adhesive-based heat sinks, the **-R0** designation indicates a mechanical mounting system:
* **Brass Push Pins:** Provides a secure, high-tension fit to the PCB.
* **Compression Springs:** Ensures consistent pressure across the surface area to avoid air gaps.
### Pin Fin Geometry
The "Square Pin Fin" design is **omni-directional**. This means the heat sink performs efficiently regardless of the direction of the airflow, making it ideal for systems with complex or turbulent internal air currents.
---
## 3. Product Numbering Breakdown
Understanding the SKU helps in identifying the specific version:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **04F** | Product Series (Push Pin Type) |
| **82** | Specific mechanical/footprint dimensions |
| **C3** | Thermal Interface Material type (T412) |
| **R0** | RoHS compliant version |
---
## 4. Typical Applications
This component is commonly found in:
* **Network Switches/Routers:** Cooling ASICs and processors.
* **Industrial PCs:** High-reliability environments requiring mechanical fastening.
* **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers.
- ⤷
What are the PCB hole diameter requirements for the ATS-04F-82-C3-R0 push pins?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Is there a version of this heat sink with a different height or fin profile?