The **ATS-04F-83-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the key technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Thermal Resistance (Unducted)** | 15.97 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.02 °C/W @ 200 LFM | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design & Construction * **Heat Sink Material:** Constructed from high-grade aluminum for a balance of weight and thermal conductivity. * **The "pushPIN™" System:** This part uses a proprietary attachment system. It features a pre-drilled hole pattern and a spring-loaded pin that provides a precise amount of pressure (compression) on the electronic component, ensuring optimal thermal contact. * **Fin Structure:** It utilizes a high-efficiency straight-fin design, which is optimized for airflow from cooling fans. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **Phase Change Material (PCM)** or thermal pad, designated by the "C1" suffix (usually signifying a high-performance thermal grease or pad). --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Attachment Style (Push-Pin) | | **F** | Pitch/Fin Density | | **83** | Specific model/size code | | **C1** | Thermal Interface Material (T766 or similar grease) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This part is commonly used in the following electronic environments: * **Telecommunications:** Cooling of networking processors. * **Embedded Systems:** Industrial PCs and small form-factor boards. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Consumer Electronics:** High-speed routers and storage devices.