The **ATS-04F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 13.30°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Design Components #### A. The Fin Design The "87" in the part number refers to a specific fin pattern. These heat sinks typically use **Straight Fins** or **Cross-Cut** patterns. This design maximizes surface area while allowing air from a fan or natural convection to pass through the gaps, carrying heat away from the base. #### B. The Push-Pin Attachment Instead of using messy adhesives or permanent solder, this model uses a **push-pin and brass spring** mechanism: * **Reliability:** Ensures consistent pressure (clamping force) between the heat sink and the chip. * **Installation:** Requires pre-drilled holes in the PCB. * **Serviceability:** Allows the heat sink to be removed for maintenance without damaging the board. #### C. Thermal Interface Material (TIM) The "C3" designation indicates the type of thermal compound pre-applied to the base. * **T412:** This is a high-performance thermal pad/grease that fills microscopic air gaps between the component and the heat sink, ensuring efficient heat transfer. --- ### 3. Application Use Cases The ATS-04F-87-C3-R0 is commonly used in environments where space is limited but thermal loads are high: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Routers, switches, and networking hardware. * **Power Electronics:** Cooling voltage regulators or power modules. ---