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  • ATS-04F-91-C1-R0

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    The **ATS-04F-91-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" thermal management series. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Type** | Board Level Heat Sink (Square) | | **Material** | Aluminum | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.86°C/W (at 100 LFM) | | **Surface Finish** | Blue Anodized | | **Thermal Interface** | T766 (Thermal Paste/Pad pre-applied) | --- ### Component Breakdown #### 1. Heat Dissipation Design The "91" series features a low-profile design (10mm height). This is critical for electronic assemblies with tight vertical space constraints, such as 1U rack servers or thin client computers. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Compression Springs:** Ensure consistent pressure across the interface for maximum heat transfer. * **Plastic/Brass Pins:** Secure the sink through pre-drilled holes in the PCB. * **Benefits:** This prevents the heat sink from shifting during vibration or shipping, which is a common failure point in high-performance electronics. #### 3. Material and Finish The **Blue Anodized** finish is not just aesthetic; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance. * Electrical insulation to prevent accidental shorts if the sink touches nearby components. --- ### Common Applications This part is typically found in the following electronic systems: * **CPUs/GPUs:** Small processors in embedded systems. * **FPGAs:** Logic gates that generate significant heat in localized areas. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Telecommunications:** Networking switches and routers.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the thermal resistance rating (C/W) for this part?
    • ⤷ How does the pushPIN mounting compare to thermal tape?
    • ⤷ What are the specific thermal interface material (TIM) properties of the T766 used here?