ATS-04F-91-C1-R0
AI

The **ATS-04F-91-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" thermal management series.
---
### Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Type** | Board Level Heat Sink (Square) |
| **Material** | Aluminum |
| **Fin Style** | Straight (Fine Pitch) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 10mm |
| **Thermal Resistance** | 21.86°C/W (at 100 LFM) |
| **Surface Finish** | Blue Anodized |
| **Thermal Interface** | T766 (Thermal Paste/Pad pre-applied) |
---
### Component Breakdown
#### 1. Heat Dissipation Design
The "91" series features a low-profile design (10mm height). This is critical for electronic assemblies with tight vertical space constraints, such as 1U rack servers or thin client computers.
#### 2. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system:
* **Compression Springs:** Ensure consistent pressure across the interface for maximum heat transfer.
* **Plastic/Brass Pins:** Secure the sink through pre-drilled holes in the PCB.
* **Benefits:** This prevents the heat sink from shifting during vibration or shipping, which is a common failure point in high-performance electronics.
#### 3. Material and Finish
The **Blue Anodized** finish is not just aesthetic; it provides:
* Increased surface emissivity for better radiation cooling.
* Corrosion resistance.
* Electrical insulation to prevent accidental shorts if the sink touches nearby components.
---
### Common Applications
This part is typically found in the following electronic systems:
* **CPUs/GPUs:** Small processors in embedded systems.
* **FPGAs:** Logic gates that generate significant heat in localized areas.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
* **Telecommunications:** Networking switches and routers.
- ⤷
What is the significance of the thermal resistance rating (C/W) for this part?
- ⤷ How does the pushPIN mounting compare to thermal tape?
- ⤷ What are the specific thermal interface material (TIM) properties of the T766 used here?