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  • ATS-04G-06-C2-R0

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    The **ATS-04G-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the primary mechanical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Thermal Resistance** | 2.52° C/W (@ 200 LFM) | | **Fin Style** | Fine Pitch (Push-Pin) | --- ### 2. Design Characteristics #### A. Thermal Interface Material (TIM) This part typically comes with a pre-applied **T766** thermal interface material. This ensures efficient heat transfer between the component (e.g., a CPU or FPGA) and the aluminum base of the heat sink by filling microscopic air gaps. #### B. Attachment Mechanism The "Push-Pin" design allows for a secure and standardized mounting process. * **Brass Pins:** Provide durability and a stable connection to the PCB. * **Springs:** Ensure consistent downward pressure to maintain thermal contact even under vibration or thermal expansion. #### C. Airflow Optimization The fin geometry is optimized for **forced air cooling**. In an environment with a fan, the vertical fins allow air to pass through with minimal pressure drop, effectively dissipating heat away from the semiconductor. --- ### 3. Application Use Cases This specific heat sink is commonly used in the following electronic systems: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. 4. **Prototyping:** Ideal for boards where frequent component swaps or secure mechanical mounting is required. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **04:** Series/Size Category * **G:** Fin/Base configuration * **06:** Height code * **C2:** Material/Finish code (Blue Anodized) * **R0:** Revision/Packaging status
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on a PCB for this push-pin heat sink?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Can the pre-applied T766 thermal material be replaced with a different compound?