ATS-04G-06-C2-R0
AI

The **ATS-04G-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs).
---
### 1. Technical Specifications
The following table summarizes the primary mechanical and thermal properties of this component:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 25mm |
| **Thermal Resistance** | 2.52° C/W (@ 200 LFM) |
| **Fin Style** | Fine Pitch (Push-Pin) |
---
### 2. Design Characteristics
#### A. Thermal Interface Material (TIM)
This part typically comes with a pre-applied **T766** thermal interface material. This ensures efficient heat transfer between the component (e.g., a CPU or FPGA) and the aluminum base of the heat sink by filling microscopic air gaps.
#### B. Attachment Mechanism
The "Push-Pin" design allows for a secure and standardized mounting process.
* **Brass Pins:** Provide durability and a stable connection to the PCB.
* **Springs:** Ensure consistent downward pressure to maintain thermal contact even under vibration or thermal expansion.
#### C. Airflow Optimization
The fin geometry is optimized for **forced air cooling**. In an environment with a fan, the vertical fins allow air to pass through with minimal pressure drop, effectively dissipating heat away from the semiconductor.
---
### 3. Application Use Cases
This specific heat sink is commonly used in the following electronic systems:
1. **Telecommunications:** Cooling high-speed networking chips.
2. **Industrial PCs:** Thermal management for embedded processors.
3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators.
4. **Prototyping:** Ideal for boards where frequent component swaps or secure mechanical mounting is required.
---
### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **04:** Series/Size Category
* **G:** Fin/Base configuration
* **06:** Height code
* **C2:** Material/Finish code (Blue Anodized)
* **R0:** Revision/Packaging status
- ⤷
What is the hole-to-hole spacing required on a PCB for this push-pin heat sink?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Can the pre-applied T766 thermal material be replaced with a different compound?