The **ATS-04G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). ### 1. Technical Specifications Below are the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 3.22 °C/W (at 200 LFM) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Material:** Made from Aluminum 6063, which offers a balance between high thermal conductivity and structural strength. * **Fin Geometry:** It uses a high-density fin pattern to maximize surface area for heat dissipation. The "30mm" height indicates it is designed for environments with sufficient vertical clearance to handle significant heat loads. #### B. The Push Pin Mounting System The "-R0" designation refers to the specific mounting kit included: * **Push Pins:** Made of brass or plastic, these insert through pre-drilled holes in the PCB. * **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the processor, ensuring optimal contact between the heat sink base and the electronic component. #### C. Thermal Interface Material (TIM) * The **"C3"** in the part number typically indicates the type of thermal interface material pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and motherboards. 3. **Power Electronics:** Cooling for MOSFETs or high-performance voltage regulators. 4. **Processors:** Used on BGA (Ball Grid Array) chips that generate moderate to high heat. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04G:** Product Series. * **101:** Specific dimensions and fin configuration. * **C3:** Thermal Interface Material (TIM) type. * **R0:** Revision/Packaging standard.