The **ATS-04G-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Part Number** | ATS-04G-142-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 7.22°C/W (at 200 LFM) | --- ### 2. Design and Components The heat sink is engineered to manage the thermal load of small to medium-sized semiconductors. * **Heat Sink Body:** Constructed from high-quality aluminum for excellent thermal conductivity. The blue anodized coating provides protection against corrosion and enhances emissivity. * **Fin Geometry:** It features a high-density fin pattern which increases the surface area for heat dissipation without significantly increasing the footprint. * **Push Pin Mounting:** This model uses a push-pin and spring system. This ensures a consistent and specific pressure (clamping force) on the electronic component, which optimizes the interface between the chip and the heat sink. * **Pre-Applied Thermal Interface Material (TIM):** Most units in this series come with a high-performance thermal pad or phase-change material pre-applied to the base to ensure low thermal resistance at the contact point. --- ### 3. Performance Characteristics The thermal performance of the **ATS-04G-142-C2-R0** is dependent on the airflow within the enclosure: * **Low Airflow (200 LFM):** Offers a thermal resistance of approximately **7.22°C/W**. * **High Airflow (over 500 LFM):** Resistance can drop significantly (below **3.5°C/W**), making it very efficient in forced-air environments. --- ### 4. Applications * **Networking Gear:** Switches, routers, and modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. ---