The **ATS-04G-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat-generating ICs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04G-152-C2-R0 | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Thermal Resistance** | ~3.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | Straight Fin (Extrusion) | | **Attachment Method** | Push-pin with Brass Spring | --- ### Key Electronic & Mechanical Components #### 1. The Heat Sink Body (Thermal Interface) The primary structure is made of **Aluminum 6063**, chosen for its high thermal conductivity and lightweight properties. * **Fin Geometry:** It uses a straight-fin design, which is optimized for **unidirectional airflow**. * **Surface Finish:** The Blue Anodized coating is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiant heat transfer. #### 2. The Mounting System (Push-Pin) Instead of adhesive tapes, this part uses a mechanical attachment system: * **Push-pins:** Made of durable plastic or metal, designed to snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These maintain a constant downward force (pressure) on the electronic chip, ensuring an airtight seal between the chip and the heat sink. #### 3. Thermal Interface Material (TIM) The "C2" in the part number usually indicates the factory-applied thermal interface. * **Pre-applied TIM:** Usually a high-performance phase-change material or thermal pad applied to the base. This fills the microscopic air gaps between the component and the heat sink to maximize heat flow. --- ### Application Usage This specific heat sink is commonly found in: * **Telecommunications:** Network switches and routers. * **Computing:** Secondary processors and high-speed memory controllers. * **Industrial Power:** Power supply modules and motor controllers. ---