ATS-04G-48-C2-R0
AI

The **ATS-04G-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 48.26mm x 48.26mm |
| **Height** | 22.86mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 2.29°C/W (at 200 LFM) |
| **Airflow Direction** | Vertical/Horizontal (Omni-directional) |
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### 2. Key Electronic Features
#### A. Thermal Management (Passive Cooling)
The primary role of this part is to increase the surface area of a heat-generating semiconductor. By utilizing a high-aspect-ratio fin design, it facilitates the transfer of heat from the component junction to the surrounding air.
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the **ATS-04G-48-C2-R0** uses a mechanical "pushPIN" system.
* **Reliability:** Ensures constant pressure between the heat sink and the electronic chip, optimizing thermal interface material (TIM) performance.
* **Vibration Resistance:** Securely locks the heat sink to the PCB, making it suitable for industrial or automotive electronics.
#### C. Fin Geometry (maxiFLOW™)
The "G" in the part number indicates a specific fin pattern designed to reduce pressure drop while maximizing airflow across the base. This is critical for dense electronic enclosures where airflow may be limited.
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### 3. Common Applications
This heat sink is typically found in the following electronic systems:
1. **Telecommunications:** Cooling of high-speed networking switches and routers.
2. **Embedded Computing:** Protecting industrial PC processors from thermal throttling.
3. **Power Supplies:** Dissipating heat from large MOSFETs or IGBT modules.
- ⤷
What are the different pushPIN spring options available for this heat sink?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for the ATS-04G series?