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  • ATS-04G-48-C2-R0

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    The **ATS-04G-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 48.26mm x 48.26mm | | **Height** | 22.86mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.29°C/W (at 200 LFM) | | **Airflow Direction** | Vertical/Horizontal (Omni-directional) | --- ### 2. Key Electronic Features #### A. Thermal Management (Passive Cooling) The primary role of this part is to increase the surface area of a heat-generating semiconductor. By utilizing a high-aspect-ratio fin design, it facilitates the transfer of heat from the component junction to the surrounding air. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-04G-48-C2-R0** uses a mechanical "pushPIN" system. * **Reliability:** Ensures constant pressure between the heat sink and the electronic chip, optimizing thermal interface material (TIM) performance. * **Vibration Resistance:** Securely locks the heat sink to the PCB, making it suitable for industrial or automotive electronics. #### C. Fin Geometry (maxiFLOW™) The "G" in the part number indicates a specific fin pattern designed to reduce pressure drop while maximizing airflow across the base. This is critical for dense electronic enclosures where airflow may be limited. --- ### 3. Common Applications This heat sink is typically found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking switches and routers. 2. **Embedded Computing:** Protecting industrial PC processors from thermal throttling. 3. **Power Supplies:** Dissipating heat from large MOSFETs or IGBT modules.
    ✨ Follow-up Questions
    • ⤷ What are the different pushPIN spring options available for this heat sink?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for the ATS-04G series?