The **ATS-04G-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. Below is a detailed breakdown of its technical specifications and electronic application characteristics. --- ### 1. General Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for precision cooling of integrated circuits (ICs). | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.79 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 25.00mm | | **Pitch** | Fine Pitch | --- ### 2. Physical Design & Geometry The design of the heat sink is optimized for maximum surface area and efficient airflow interaction. * **Fin Type:** Straight Fin / Fine Pitch. This design is ideal for high-speed airflow environments where the air can pass through narrow gaps to carry heat away. * **Base Dimensions:** 35mm x 35mm, making it suitable for BGA (Ball Grid Array) and CPU/GPU chips of similar sizes. * **Height:** 25mm, providing a balance between cooling capacity and vertical clearance in compact electronic enclosures. --- ### 3. Thermal Performance Data Thermal resistance measures how effectively the part moves heat away from the electronic component. Lower values are better. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 10.79 °C/W | 3.22 °C/W | 1.92 °C/W | | **Ducted Flow** | 2.31 °C/W | 1.48 °C/W | 1.21 °C/W | --- ### 4. Electronic Integration Features * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin system with a brass or plastic pin and a stainless steel spring. * **Pre-assembled TIM:** Usually comes with a **Thermal Interface Material (TIM)** pre-applied to the base, ensuring a low-resistance thermal path between the chip and the aluminum. * **Reliability:** The mechanical spring ensures consistent pressure over time, preventing the heat sink from detaching due to vibration or thermal expansion. --- ### 5. Common Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial PCs where heat dissipation is critical for longevity. * **Power Electronics:** Cooling MOSFETs or power regulators in a PCB layout.