ATS-04G-63-C2-R0
AI

The **ATS-04G-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB components.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 20mm |
| **Thermal Resistance** | 12.32 °C/W (at 1.0 m/s airflow) |
| **Attachment Type** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (High performance) |
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### 2. Key Components & Design Features
#### A. Fin Profile (Straight Fin)
The "04G" designation indicates a straight-fin geometry. This design is optimized for **unidirectional airflow**, allowing air to pass through the channels with low pressure drop.
#### B. Attachment Mechanism (Push Pin & Spring)
Unlike adhesive-based heat sinks, this model uses a mechanical mounting system:
* **Push Pins:** Durable brass pins that snap into pre-drilled holes on the PCB.
* **Compression Springs:** These provide consistent downward pressure to ensure maximum contact between the heat sink base and the electronic component.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal impedance.
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### 3. Applications
This electronic part is typically used to cool high-heat-generating components such as:
* **CPUs/GPUs:** Small form factor processors.
* **FPGAs:** Field Programmable Gate Arrays in networking gear.
* **ASICs:** Application-specific integrated circuits.
* **Power Modules:** High-density power supplies and converters.
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### 4. Part Number Breakdown (Nomenclature)
To understand the variations of this part, here is the breakdown of the code:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04G:** Series/Fin Type (Straight Fin).
* **63:** Specific length/width dimensions.
* **C2:** Thermal performance/Fin height category.
* **R0:** RoHS compliant (Standard packaging).
- ⤷
What are the PCB hole diameter requirements for the brass push pins in this model?
- ⤷ How does the thermal resistance change at higher airflow speeds like 2.0 m/s?
- ⤷ Can this heat sink be used with a different thermal interface material if T766 is not suitable?