The **ATS-04G-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient cooling of integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (Straight Fin) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~40-50 grams | --- ### 2. Component Breakdown #### A. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **T766 phase change material** or a high-performance thermal grease. This eliminates the need for manual application and ensures minimal thermal resistance between the heat source (CPU/GPU/FPGA) and the aluminum base. #### B. Mounting System (pushPIN™) The "R0" designation refers to the mounting hardware. This model uses a plastic or brass push-pin with a stainless steel spring. * **Pressure:** Provides consistent, high-interface pressure to optimize heat transfer. * **Installation:** Quick-release mechanism that requires pre-drilled holes in the PCB (usually 3.175mm diameter). #### C. Fin Geometry The "G" in the part number signifies a specific fin density. This model uses **Straight Fins**, which are ideal for high-velocity airflow environments where air can be directed through the channels to strip away heat. --- ### 3. Usage Context This part is commonly found in the following electronic applications: * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs or power conversion modules. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.31 | | 300 | 1.5 | 5.30 | | 500 | 2.5 | 3.59 | | 700 | 3.5 | 2.86 |