ATS-04G-80-C2-R0
AI

The **ATS-04G-80-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for electronic cooling applications where space is limited and thermal efficiency is critical.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Flowing)** | 1.90 °C/W (@100 LFM) |
| **Thermal Resistance (Unducted)** | 7.03 °C/W (@100 LFM) |
| **Dimensions (L x W x H)** | 30mm x 30mm x 25mm |
| **TIM (Thermal Interface Material)** | T766 (High Performance) |
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### 2. Physical Design and Construction
### A. Fin Geometry
This model utilizes **Square Fins**. Square fin patterns are highly effective for "all-direction" airflow, meaning they can dissipate heat efficiently even if the airflow direction changes or is turbulent within the chassis.
### B. Attachment System (pushPIN™)
The "C2" in the part number indicates the hardware kit used for mounting. This system includes:
* **Brass Push Pins:** For secure, tool-free installation.
* **Compression Springs:** These provide precise, repeatable pressure (preload) on the electronic component (CPU, GPU, or ASIC).
* **Plastic/Metal Pins:** Designed to fit into pre-drilled holes on the PCB.
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### 3. Electronic Application Use-Cases
The ATS-04G-80-C2-R0 is typically used for cooling small to medium-sized electronic components, such as:
* **FPGAs (Field Programmable Gate Arrays):** Ideal for high-density logic boards.
* **Microprocessors/ASICs:** Suitable for low-to-mid power chips that require vertical clearance (25mm height).
* **Power Modules:** Used in telecommunications and networking equipment where airflow is managed.
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### 4. Part Number Breakdown
Understanding the nomenclature helps identify the specific electronic requirements:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04:** Product Series.
* **G:** Fin style/Geometry.
* **80:** Heat sink size/dimension code.
* **C2:** Hardware attachment type (Spring/Pin kit).
* **R0:** Revision/Finish code (Blue Anodized).
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What is the significance of the T766 thermal interface material used in this model?
- ⤷ How does the pushPIN™ system compare to traditional adhesive or screw-based mounting?
- ⤷ What are the specific thermal resistance values at higher airflow speeds like 500 LFM?