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  • ATS-04G-80-C2-R0

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    The **ATS-04G-80-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series and is designed for electronic cooling applications where space is limited and thermal efficiency is critical. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.90 °C/W (@100 LFM) | | **Thermal Resistance (Unducted)** | 7.03 °C/W (@100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### 2. Physical Design and Construction ### A. Fin Geometry This model utilizes **Square Fins**. Square fin patterns are highly effective for "all-direction" airflow, meaning they can dissipate heat efficiently even if the airflow direction changes or is turbulent within the chassis. ### B. Attachment System (pushPIN™) The "C2" in the part number indicates the hardware kit used for mounting. This system includes: * **Brass Push Pins:** For secure, tool-free installation. * **Compression Springs:** These provide precise, repeatable pressure (preload) on the electronic component (CPU, GPU, or ASIC). * **Plastic/Metal Pins:** Designed to fit into pre-drilled holes on the PCB. --- ### 3. Electronic Application Use-Cases The ATS-04G-80-C2-R0 is typically used for cooling small to medium-sized electronic components, such as: * **FPGAs (Field Programmable Gate Arrays):** Ideal for high-density logic boards. * **Microprocessors/ASICs:** Suitable for low-to-mid power chips that require vertical clearance (25mm height). * **Power Modules:** Used in telecommunications and networking equipment where airflow is managed. --- ### 4. Part Number Breakdown Understanding the nomenclature helps identify the specific electronic requirements: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Product Series. * **G:** Fin style/Geometry. * **80:** Heat sink size/dimension code. * **C2:** Hardware attachment type (Spring/Pin kit). * **R0:** Revision/Finish code (Blue Anodized).
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 thermal interface material used in this model?
    • ⤷ How does the pushPIN™ system compare to traditional adhesive or screw-based mounting?
    • ⤷ What are the specific thermal resistance values at higher airflow speeds like 500 LFM?