The **ATS-04G-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCB components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance (Unducted)** | 10.79 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.38 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part number can be broken down into functional electronic and mechanical features: * **Fin Profile:** This model uses a **straight fin** design. Straight fins provide low pressure drop and are ideal for systems with high-velocity airflow. * **Thermal Interface Material (TIM):** It comes with pre-applied **T766** phase-change material. This ensures optimal heat transfer between the electronic chip (like a BGA or FPGA) and the aluminum base by filling microscopic air gaps. * **Attachment System:** The `pushPIN™` mechanism uses a flexible, tool-free spring-loaded pin system. This provides a consistent "clamping force" on the electronic component, preventing damage while ensuring maximum thermal contact. --- ### 3. Electronic Application Use-Cases This heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of network processors and high-speed switches. 2. **Embedded Systems:** Thermal regulation for industrial SoCs (System on Chips). 3. **Power Electronics:** Managing heat for voltage regulators or high-power transistors. 4. **Computing:** Cooling of secondary chipsets or high-end VRMs (Voltage Regulator Modules) on motherboards. --- ### 4. Code Representation (Thermal Simulation Input) If you are integrating this part into a thermal simulation or CAD metadata, the properties would be represented as follows: ```json { "part_number": "ATS-04G-82-C2-R0", "manufacturer": "Advanced Thermal Solutions Inc.", "category": "Thermal Management - Heat Sinks", "material_conductivity": 209, "unit": "W/m-K", "attachment": { "type": "pushPIN", "pitch": "35.00mm" } } ```