The **ATS-04G-92-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### 1. Key Technical Specifications Below are the electronic and physical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Type** | XCUT (Cross-Cut) | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### 2. Electronic Component Breakdown #### A. Fin Design (XCUT Technology) The "G" in the part number indicates a **Cross-Cut** fin pattern. In electronic cooling, this design allows for multi-directional airflow. This is critical in modern PCB layouts where air might not flow in a straight line, ensuring the component stays cool regardless of turbulence. #### B. Thermal Interface Material (T766) The unit comes pre-applied with **T766 Phase Change Material**. * **Function:** It fills the microscopic air gaps between the chip (die) and the aluminum base. * **Benefit:** Unlike standard grease, it changes phase as the component heats up, providing lower thermal resistance and preventing "pump-out" over long-term electronic operation. #### C. Mounting Mechanism (Push-Pin & Spring) The "C2" suffix refers to the specific attachment hardware: * **Push-Pin:** Allows for fast, tool-free assembly on the PCB. * **Spring-Loaded:** Provides a precise, calculated **compression force**. This ensures the heat sink stays in contact with the electronic chip without cracking the delicate silicon die or damaging the solder balls (BGA) underneath. --- ### 3. Performance Metrics Thermal performance is measured by how effectively the part moves heat away from the silicon. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.48 | | 300 | 1.5 | 7.45 | | 500 | 2.5 | 5.30 | --- ### 4. Part Number Decoder Understanding the naming convention: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04**: Series (Push-Pin series). * **G**: Fin style (Cross-cut). * **92**: Dimensional code. * **C2**: Attachment kit (Plastic push-pin + specific spring). * **R0**: RoHS compliant (lead-free).