The **ATS-04G-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Fin Type** | Cross-Cut | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 15.31 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Cross-Cut) Unlike traditional straight-fin heat sinks, the ATS-04G-98-C2-R0 uses a **Cross-Cut** pattern. This design allows for: * **Omnidirectional Airflow:** Air can enter from any side, making it ideal for systems where the fan placement is not directly aligned with the heat sink. * **Increased Surface Area:** Maximizes the area available for heat dissipation relative to the volume. ### B. pushPIN™ Attachment System This part uses a specific mechanical attachment method rather than thermal adhesive: * **Spring-Loaded Pins:** Provides a consistent, pre-determined pressure on the component, ensuring optimal contact with the die. * **Plastic/Brass Pins:** Available in different materials to accommodate various PCB hole sizes. ### C. Thermal Interface Material (TIM) The unit comes with **T766** thermal grease pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the heat sink base and the electronic component to lower thermal resistance. --- ## 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) determines how efficiently the heat sink moves heat away from the component into the air. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 15.31 °C/W | 5.81 °C/W | 3.50 °C/W | --- ## 4. Typical Applications * **Networking Equipment:** Routers and switches with high-speed processors. * **Embedded Systems:** Compact industrial computers. * **Power Supplies:** Cooling voltage regulators or power MOSFETs.