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  • ATS-04H-07-C1-R0

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    The **ATS-04H-07-C1-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the **blueICE™** series, designed for cooling high-heat-generating electronic components like BGAs (Ball Grid Arrays). --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.97°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Attachment Method** | pushPIN™ | | **Pin Pitch** | 1.27 mm | | **Weight** | ~25 grams | --- ## 2. Key Components & Features ### A. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a **pushPIN™** system. * **Design:** It consists of a spring-loaded pin that passes through pre-drilled holes in the PCB. * **Benefit:** Ensures consistent pressure (clamping force) between the heat sink and the chip, maximizing heat transfer. ### B. Cross-Cut Fin Design The "04H" in the part number indicates a specific fin geometry. * **Function:** The fins are cut in a way that allows air to flow from any direction (omni-directional). * **Application:** Ideal for systems where the direction of the cooling fan's airflow might be obstructed or variable. ### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with **T412** thermal interface material. * **Purpose:** Fills microscopic air gaps between the CPU/GPU and the aluminum base to reduce thermal impedance. --- ## 3. Physical Dimensions (Top View) To integrate this into a PCB design, the following spacing is required: ```text 45.00 mm <------------------> ____________________ ^ | | | | (Fins) | | 45.00 mm | | | |____________________| v (Base) ``` --- ## 4. Usage Considerations * **Clearance:** Ensure there is 12.70mm of vertical clearance above the chip. * **PCB Holes:** The PCB must have specific mounting holes to accommodate the pushPIN™ springs. * **Environment:** The blue anodized finish provides increased corrosion resistance and surface area for radiation.
    ✨ Follow-up Questions
    • ⤷ What is the exact hole pattern required on the PCB for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at higher airflow speeds like 500 LFM?
    • ⤷ Are there alternative attachment methods if the PCB does not have mounting holes?