ATS-04H-07-C1-R0
AI

The **ATS-04H-07-C1-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the **blueICE™** series, designed for cooling high-heat-generating electronic components like BGAs (Ball Grid Arrays).
---
## 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of the part:
| Parameter | Value / Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 16.97°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm |
| **Attachment Method** | pushPIN™ |
| **Pin Pitch** | 1.27 mm |
| **Weight** | ~25 grams |
---
## 2. Key Components & Features
### A. pushPIN™ Attachment
Unlike adhesive tapes that can fail under high heat, this part uses a **pushPIN™** system.
* **Design:** It consists of a spring-loaded pin that passes through pre-drilled holes in the PCB.
* **Benefit:** Ensures consistent pressure (clamping force) between the heat sink and the chip, maximizing heat transfer.
### B. Cross-Cut Fin Design
The "04H" in the part number indicates a specific fin geometry.
* **Function:** The fins are cut in a way that allows air to flow from any direction (omni-directional).
* **Application:** Ideal for systems where the direction of the cooling fan's airflow might be obstructed or variable.
### C. Thermal Interface Material (TIM)
* **Pre-Applied:** This specific model usually comes with **T412** thermal interface material.
* **Purpose:** Fills microscopic air gaps between the CPU/GPU and the aluminum base to reduce thermal impedance.
---
## 3. Physical Dimensions (Top View)
To integrate this into a PCB design, the following spacing is required:
```text
45.00 mm
<------------------>
____________________ ^
| | |
| (Fins) | | 45.00 mm
| | |
|____________________| v
(Base)
```
---
## 4. Usage Considerations
* **Clearance:** Ensure there is 12.70mm of vertical clearance above the chip.
* **PCB Holes:** The PCB must have specific mounting holes to accommodate the pushPIN™ springs.
* **Environment:** The blue anodized finish provides increased corrosion resistance and surface area for radiation.
- ⤷
What is the exact hole pattern required on the PCB for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher airflow speeds like 500 LFM?
- ⤷ Are there alternative attachment methods if the PCB does not have mounting holes?