ATS-04H-08-C1-R0
AI

The **ATS-04H-08-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the key physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Heat Sink Type** | Push-Pin (Spring-loaded) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 14.57°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Attachment Method** | Brass Push-Pin with Steel Spring |
| **Thermal Interface Material (TIM)** | ATS-PPS-04 (Pre-applied) |
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### 2. Core Electronic Components & Design
#### A. The Heat Sink Body
The body is constructed from **Aluminum 6063**, chosen for its high thermal conductivity and lightweight properties. The blue anodized finish is not just aesthetic; it provides surface protection and slightly increases emissivity for better radiative cooling.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the "04H" series uses a mechanical attachment:
* **Brass Pins:** Provide a secure anchor into pre-drilled holes on the PCB.
* **Compression Springs:** These ensure consistent **downward pressure** (clamping force) on the electronic chip, which is critical for minimizing the air gap between the component and the heat sink.
#### C. Thermal Interface Material (TIM)
The "C1" in the part number indicates that the unit comes with a pre-applied **Thermal Phase Change Material**.
* **Function:** It fills the microscopic imperfections between the chip surface and the heat sink base to maximize heat transfer efficiency.
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### 3. Application Use-Case
This part is typically found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PC motherboards.
3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in selecting the right electronic cooling solution:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04H** | Push-Pin Series / Hole pattern |
| **08** | Specific Fin Geometry/Design |
| **C1** | Thermal Interface Material (TIM) Type |
| **R0** | RoHS Compliant / Revision Status |
- ⤷
What are the PCB hole requirements for the ATS-04H push-pin system?
- ⤷ How does the airflow velocity (LFM) affect the thermal resistance of this heat sink?
- ⤷ Can the pre-applied thermal material be replaced with standard thermal paste?