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  • ATS-04H-08-C1-R0

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    The **ATS-04H-08-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 14.57°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Brass Push-Pin with Steel Spring | | **Thermal Interface Material (TIM)** | ATS-PPS-04 (Pre-applied) | --- ### 2. Core Electronic Components & Design #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, chosen for its high thermal conductivity and lightweight properties. The blue anodized finish is not just aesthetic; it provides surface protection and slightly increases emissivity for better radiative cooling. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "04H" series uses a mechanical attachment: * **Brass Pins:** Provide a secure anchor into pre-drilled holes on the PCB. * **Compression Springs:** These ensure consistent **downward pressure** (clamping force) on the electronic chip, which is critical for minimizing the air gap between the component and the heat sink. #### C. Thermal Interface Material (TIM) The "C1" in the part number indicates that the unit comes with a pre-applied **Thermal Phase Change Material**. * **Function:** It fills the microscopic imperfections between the chip surface and the heat sink base to maximize heat transfer efficiency. --- ### 3. Application Use-Case This part is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PC motherboards. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in selecting the right electronic cooling solution: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04H** | Push-Pin Series / Hole pattern | | **08** | Specific Fin Geometry/Design | | **C1** | Thermal Interface Material (TIM) Type | | **R0** | RoHS Compliant / Revision Status |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS-04H push-pin system?
    • ⤷ How does the airflow velocity (LFM) affect the thermal resistance of this heat sink?
    • ⤷ Can the pre-applied thermal material be replaced with standard thermal paste?