ATS-04H-100-C2-R0
AI

The **ATS-04H-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (with Blue Anodized finish) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Attachment Method** | Push Pin (with Brass Springs) |
| **Thermal Resistance** | 8.69°C/W (at 200 LFM airflow) |
| **Thermal Interface** | T766 Phase Change Material (Pre-applied) |
| **Fin Type** | Straight Fin |
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### 2. Key Component Features
#### A. Attachment Mechanism (Push Pin)
The "R0" suffix indicates the specific hardware used for mounting. This model uses a **plastic push pin** combined with a **brass spring**.
* **Purpose:** Ensures consistent pressure on the electronic component (IC), which maximizes thermal contact.
* **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board).
#### B. Thermal Interface Material (TIM)
This heat sink comes with **T766** pre-applied to the base.
* **Function:** T766 is a phase-change material that softens at high temperatures, filling microscopic air gaps between the heat sink and the chip.
* **Benefit:** This reduces thermal resistance significantly compared to air or low-quality pads.
#### C. Material and Coating
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides increased surface emissivity, slightly improving heat dissipation via radiation and protecting the aluminum from corrosion.
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### 3. Application Use Cases
This specific heat sink is typically used for:
1. **Network Switches/Routers:** Cooling ASICs and high-speed processors.
2. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers.
3. **Industrial PCs:** Ensuring stability in fanless or low-airflow environments.
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- ⤷What is the difference between push pin and clip-on heat sink attachments?
- ⤷ How do I calculate if the 8.69°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative thermal interface materials for this specific model?