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  • ATS-04H-100-C2-R0

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    The **ATS-04H-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | Push Pin (with Brass Springs) | | **Thermal Resistance** | 8.69°C/W (at 200 LFM airflow) | | **Thermal Interface** | T766 Phase Change Material (Pre-applied) | | **Fin Type** | Straight Fin | --- ### 2. Key Component Features #### A. Attachment Mechanism (Push Pin) The "R0" suffix indicates the specific hardware used for mounting. This model uses a **plastic push pin** combined with a **brass spring**. * **Purpose:** Ensures consistent pressure on the electronic component (IC), which maximizes thermal contact. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### B. Thermal Interface Material (TIM) This heat sink comes with **T766** pre-applied to the base. * **Function:** T766 is a phase-change material that softens at high temperatures, filling microscopic air gaps between the heat sink and the chip. * **Benefit:** This reduces thermal resistance significantly compared to air or low-quality pads. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides increased surface emissivity, slightly improving heat dissipation via radiation and protecting the aluminum from corrosion. --- ### 3. Application Use Cases This specific heat sink is typically used for: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers. 3. **Industrial PCs:** Ensuring stability in fanless or low-airflow environments. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between push pin and clip-on heat sink attachments?
    • ⤷ How do I calculate if the 8.69°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there alternative thermal interface materials for this specific model?