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  • ATS-04H-11-C2-R0

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    The **ATS-04H-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 50mm x 50mm x 10mm | | **Thermal Resistance** | 18.78°C/W (Unducted @ 100 LFM) | | **Fin Style** | Straight Fin | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry The "Straight Fin" design is optimized for high-velocity airflow environments. By increasing the surface area of the aluminum, heat is more efficiently dissipated from the component into the surrounding air. #### B. The pushPIN™ Mechanism This part utilizes a specific mounting system consisting of: * **Compression Springs:** Provide precise, even pressure across the thermal interface to ensure maximum heat transfer. * **Plastic/Brass Push Pins:** Secure the heat sink to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases The ATS-04H-11-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking switches and routers. 2. **Industrial PC:** Cooling processors in fan-less or restricted-airflow enclosures. 3. **Power Electronics:** Managing heat in power converters and motor controllers. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the maximum 18.78°C/W thermal resistance?
    • ⤷ How does the T766 interface material compare to standard thermal pads?
    • ⤷ Can this heat sink be customized for different PCB hole patterns?