ATS-04H-11-C2-R0
AI

The **ATS-04H-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this component:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 50mm x 50mm x 10mm |
| **Thermal Resistance** | 18.78°C/W (Unducted @ 100 LFM) |
| **Fin Style** | Straight Fin |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Design and Component Breakdown
#### A. Fin Geometry
The "Straight Fin" design is optimized for high-velocity airflow environments. By increasing the surface area of the aluminum, heat is more efficiently dissipated from the component into the surrounding air.
#### B. The pushPIN™ Mechanism
This part utilizes a specific mounting system consisting of:
* **Compression Springs:** Provide precise, even pressure across the thermal interface to ensure maximum heat transfer.
* **Plastic/Brass Push Pins:** Secure the heat sink to the PCB through pre-drilled holes.
#### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no microscopic air gaps between the heat sink and the electronic chip.
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### 3. Application Use Cases
The ATS-04H-11-C2-R0 is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed networking switches and routers.
2. **Industrial PC:** Cooling processors in fan-less or restricted-airflow enclosures.
3. **Power Electronics:** Managing heat in power converters and motor controllers.
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- ⤷
What are the airflow requirements to achieve the maximum 18.78°C/W thermal resistance?
- ⤷ How does the T766 interface material compare to standard thermal pads?
- ⤷ Can this heat sink be customized for different PCB hole patterns?