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  • ATS-04H-110-C2-R1

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    The **ATS-04H-110-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for thermal management in electronic systems, primarily to cool Integrated Circuits (ICs) and other heat-generating surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Fin Style** | XC (Cross-Cut) | | **Thermal Resistance** | 2.69°C/W (at 100 LFM) | | **Flow Orientation** | Omnidirectional (Cross-cut) | --- ### 2. Key Design Elements #### A. Fin Design (XC - Cross-Cut) The "XC" designation indicates a **Cross-Cut fin pattern**. Unlike straight-fin heat sinks, the cross-cut design creates a grid of square pins. * **Benefit:** This provides an omnidirectional airflow capability, meaning the heat sink performs efficiently regardless of which direction the cooling air is flowing across the PCB. #### B. pushPIN™ Attachment This model uses the proprietary ATS **pushPIN™** system for mounting. * **Mechanism:** It utilizes a spring-loaded pin that snaps into pre-drilled holes in the PCB. * **Advantage:** This ensures consistent pressure (clamping force) between the heat sink and the component, which optimizes thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. #### C. Thermal Performance The thermal resistance of **2.69°C/W** at low airflow indicates it is highly efficient. As airflow (LFM - Linear Feet per Minute) increases, the resistance drops significantly, allowing for more aggressive cooling in forced-convection environments. --- ### 3. Applications The ATS-04H-110-C2-R1 is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Server CPUs, GPUs, and FPGAs. * **Power Electronics:** Power supplies and converters requiring compact but high-surface-area cooling. --- ### 4. Part Number Breakdown `ATS - 04 H - 110 - C2 - R1` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series/Product family. * **H:** Attachment type/Spring strength. * **110:** Specific dimension/configuration code. * **C2:** Material/Finish (Blue Anodized). * **R1:** Revision or Packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at 500 LFM?
    • ⤷ What are the specific hole patterns required on the PCB for the pushPIN™ attachment?
    • ⤷ How does blue anodization affect the thermal radiation properties compared to bare aluminum?