The **ATS-04H-112-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Dimension (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Thermal Resistance** | 2.63 °C/W (at 200 LFM) | | **Spring Type** | ATS-CPX-035035025-112-C2-R1 | --- ### 2. Key Electronic Components & Design Features #### A. The Heat Sink Profile (push-PIN™) The "push-PIN" system is an integrated assembly that includes a flexible attachment mechanism. This is critical for electronics because: * **Constant Pressure:** It ensures the thermal interface material (TIM) is compressed evenly against the chip. * **Secure Fit:** The pre-assembled springs provide a specific force to prevent the heat sink from shifting during vibration. #### B. Thermal Performance In electronics, managing "Thermal Resistance" is vital. This part is designed for **straight-fin** airflow. * **Active Cooling:** It works best when paired with a fan (forced convection). * **Efficiency:** The 2.63 °C/W rating means for every watt of power the electronic chip dissipates, the temperature will rise by 2.63 degrees Celsius above the ambient air temperature. #### C. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Anodization is not just for aesthetics; it increases the surface emissivity (improving radiation cooling) and provides a layer of electrical insulation and corrosion resistance. --- ### 3. Typical Applications This specific size (35mm x 35mm) is commonly used on: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Industrial PCs:** Maintaining stability in fanless or high-airflow enclosures. 3. **Power Converters:** Dissipating heat from MOSFETs or IGBT modules. ---