The **ATS-04H-115-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed specifically for thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Pitch** | Square Fin | | **Attachment Type** | pushPIN™ (Spring Loaded) | | **Thermal Resistance (Unducted)** | 5.33 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.77 °C/W @ 100 LFM | --- ### 2. Design Breakdown The "C2" and "R0" designations in the part number refer to specific material and environmental compliance standards: #### A. The Fin Design * **Square Fin:** The fins are arranged in a grid pattern to maximize surface area while allowing airflow from multiple directions. This is ideal for systems where the airflow direction is not strictly linear. * **Material:** Lightweight aluminum allows for rapid heat dissipation while keeping the total weight on the PCB low. #### B. The pushPIN™ Attachment System Instead of using adhesive tape or standard screws, this part uses a pre-assembled push-pin system: * **Compression Springs:** Provides precise pressure (Force) to ensure optimal contact with the heat source (TIM - Thermal Interface Material). * **Reliability:** Reduces the risk of the heat sink shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The **"R0"** variant typically comes with a pre-applied high-performance thermal interface material (usually **T766**), which fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This specific heat sink is commonly used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Chipset cooling on motherboards or small form factor PCs. 3. **Industrial:** Embedded systems and power supply modules that require robust mechanical attachment. ---